Through-silicon via

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51	3A-1 System-Level Cost Analysis and Design Exploration for Three-Dimensional Add to Reading List Source URL: www.cse.psu.edu Language: English - Date: 2009-02-25 12:13:45 Semiconductor device fabrication Electromagnetism Electronic design automation Three-dimensional integrated circuit Back end of line Through-silicon via Application-specific integrated circuit Very-large-scale integration Wafer Electronic engineering Electronics Integrated circuits
52	PDF Document Add to Reading List Source URL: www.tezzaron.com Language: English - Date: 2008-02-08 14:35:02 Semiconductor device fabrication Electromagnetism Semiconductor devices Three-dimensional integrated circuit Through-silicon via Light-emitting diode Back end of line Integrated circuits Electronics Electronic engineering
53	PDF Document Add to Reading List Source URL: www.ifte.de Language: English - Date: 2012-01-31 08:03:49 Integrated circuits Semiconductor device fabrication Constraint graph Electronic design Physical design Placement Floorplan Through-silicon via Cluster analysis Electronic engineering Electronic design automation Electronics